Asus ROG Phone 3 gets the teardown treatment, there is a massive vapor chamber inside

The Asus ROG Phone 3 is about to play a high-stakes game of teardown – as always, the final boss is Zack from JerryRigEverything. The big question is how much of the design is there just to look cool and how much has an actual function.

It turns out that the answer is “more than before”. The glass window on the back has a vent to let hot air out (and a mesh to keep dust out). It sits right on top of a fairly chunky metal panel, which soaks up heat from the chipset through a layer of thermal paste.

Another interesting element is the tiny board, which powers the RGB LEDs on the back – this is a gaming phone after all, RGB LEDs are a staple of the genre. Further into the video it turns out that underneath the motherboard is what is probably the largest vapor chamber on any phone, Asus took every opportunity to improve cooling.

And it worked, our benchmarks show that the ROG Phone 3 can stave off thermal throttling for a long time and when it does need to throttle, it does it gradually and predictably. Still, if you want to enable the high performance X Mode, you’ll probably also want to use the external cooling fan as well (good thing it comes in the box).

Source: Gsmarena