Just last month, benchmarks from Geekbench hinted that Asus was prepping its next flagship Zenfone model, set to be powered by the new Snapdragon 865 Plus. Now, the rumoured Zenfone 7 series looks to be taking shape as it passes through official certification processes.
As MySmartPrice spotted, the device received wireless certification in Taiwan’s National Communications Commission, hinting that the device’s official launch may not be too far at hand. The listing also reveals a number of fairly impressive key specs.
Various sources have already leaked a number of other details, and the device is expected to rock the latest Snapdragon chipset and a whopping 16GB of RAM to keep everything super speedy. Interestingly, it’s also said to mark the comeback of the Zenfone 6’s distinctive flip-camera design, so the main rear camera module can function as the selfie camera as well.
Asus is hardly the largest name in the mobile industry, but last year’s Zenfone 6 was an unexpected dark horse of the 2019 flagship landscape with its innovative design and low price point. From what we know so far, the Zenfone 7 looks like it could be an even more impressive device, depending on the price.
The latest Zenfone is also expected to have a 6.7-inch display, up from the 6.4 inches of real estate on its predecessor. The Zenfone 6’s LCD display was one of the only weak points of the device, with just average colors, sharpness, and contrast, so we’re excited to see whether this year’s model will offer any improvements.
There are also rumours of a separate Zenfone 7 Pro, though we may need to wait until official announcements before reaching any conclusions. Regardless, the Zenfone 7 seems to be almost ready for launch, so soon we’ll know what else it has to offer.
Source: Phonearena
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